Design and modelling tools (CAD, EDA...) / Materials (crystals, nanomaterials, raw materials for microelectronics...), advanced substrates / Microelectronic equipment and processes (surface treatments, front end manufacturing, back end, test, functional characterization , robustness and reliability) / Memory components, microprocessors and other integrated circuits (analog, digital, mixed analog & digital) / Active components (amplifiers, antennas...) and passive components (capacitors, inductances) RF, microwave, THz / Energy components (micro batteries, passive...) diodes and power transistors...) / MEMS and NEMS components, sensors, actuators / Technologies (hardware) for the security of electronic components and systems / Packaging (Moduleing, Hermetic and no hermetic packaging, System In Package, Cryogenic packaging...) and 3D printing / PCB, electronic boards (EMS) / 3D integration (electronic & micro-fluidic interposers, Wafer Level Packaging...) / Organic, printed and supermarket electronics / Electronic solutions and systems / Installation/maintenance of specialized infrastructures (clean rooms, anhydrous rooms, test rooms and carac.... / Others: Micro-nano training (microelectronics, RF, power, digital transformation)...
Infrastructure (computer/Servers/Storage /Networks and Telecom, High Performance Computing) / Simulation/Modelling / Data (data processing, Big Data, Database) / Internet of Things / Artificial Intelligence / Software vendors (Business applications, Web & Mobile Application, Software tools, OpenSource) / EmSOC (embedded software, industrial software, formal methods) / Digital security / Other.
Displays and screens / Holography / Diffractive optics / Detectors / Cameras / Imaging instruments / Optical instruments / Optical instruments / Spectometry / Guided optics / Optical fibers / Platforms / Motors / Piezoelectric actuators / Thin films / Materials / Signal and image processing / Lighting/Sources/lasers/LED/OLEDS / Micro/nano optics, integrated optics / Simulation/modelling / Other.
Interactive technologies (HMI, NUI, robotic interaction, no interface) / Immersive technologies (AR/VR/MR/Immersive rooms...) / Sensory technologies (haptics, olfactory, sound...) / Brain interfaces and neuro-technologies (brain-computer interface, emotiv headset...) / Sound and voice technologies (digital lutherie, acoustics, voice interfaces,...) / Broadcast and distribution of content / Content creation technologies (VFX, game engine, texturing,...) / Information, Communication & Datavisualization (storytelling, indicators, charts, graphics, DPA...) / Design (product, services, interfaces....) / Creativity (ideation, methodology, gamification...) / Others.
Among technology provider
Minalogic Business Meetings is the reference event on innovation in Micro/Nano/Electronics, Photonics, Software, Content and Uses.