Design and modelling tools (CAD, EDA...) / Materials (crystals, nanomaterials, raw materials for microelectronics...), advanced substrates / Microelectronic equipment and processes (surface treatments, front end manufacturing, back end, test, functional characterization , robustness and reliability) / Memory components, microprocessors and other integrated circuits (analog, digital, mixed analog & digital) / Active components (amplifiers, antennas...) and passive components (capacitors, inductances) RF, microwave, THz / Energy components (micro batteries, passive...) diodes and power transistors...) / MEMS and NEMS components, sensors, actuators / Technologies (hardware) for the security of electronic components and systems / Packaging (Moduleing, Hermetic and no hermetic packaging, System In Package, Cryogenic packaging...) and 3D printing / PCB, electronic boards (EMS) / 3D integration (electronic & micro-fluidic interposers, Wafer Level Packaging...) / Organic, printed and supermarket electronics / Electronic solutions and systems / Installation/maintenance of specialized infrastructures (clean rooms, anhydrous rooms, test rooms and carac.... / Others: Micro-nano training (microelectronics, RF, power, digital transformation)...
Infrastructure (computer/Servers/Storage /Networks and Telecom, High Performance Computing) / Simulation/Modelling / Data (data processing, Big Data, Database) / Internet of Things / Artificial Intelligence / Software vendors (Business applications, Web & Mobile Application, Software tools, OpenSource) / EmSOC (embedded software, industrial software, formal methods) / Digital security / Other.
Displays and screens / Holography / Diffractive optics / Detectors / Cameras / Imaging instruments / Optical instruments / Optical instruments / Spectometry / Guided optics / Optical fibers / Platforms / Motors / Piezoelectric actuators / Thin films / Materials / Signal and image processing / Lighting/Sources/lasers/LED/OLEDS / Micro/nano optics, integrated optics / Simulation/modelling / Other.
Interactive technologies (HMI, NUI, robotic interaction, no interface) / Immersive technologies (AR/VR/MR/Immersive rooms...) / Sensory technologies (haptics, olfactory, sound...) / Brain interfaces and neuro-technologies (brain-computer interface, emotiv headset...) / Sound and voice technologies (digital lutherie, acoustics, voice interfaces,...) / Broadcast and distribution of content / Content creation technologies (VFX, game engine, texturing,...) / Information, Communication & Datavisualization (storytelling, indicators, charts, graphics, DPA...) / Design (product, services, interfaces....) / Creativity (ideation, methodology, gamification...) / Others.
Among technology provider
Minalogic Business Meetings is the reference event on innovation in Micro/Nano/Electronics, Photonics, Software, Content and Uses.
"The formula: B2B meetings are very effective for us. There are many industrial players in the MEMS and high technology sectors in general around Lyon, Grenoble and Besançon, representing many potential customers."
"Good concentration on semiconductor segments to find business partners in Europe."
"Équipe disponible / professionnelle / engagée et concernée par les problématiques."
"It’s an excellent idea. We need to develop those kinds of initiatives and repeat them more often."